| Place of Origin: | China |
|---|---|
| Brand Name: | FODOR |
| Certification: | ISO9001:2015 |
| Model Number: | HEAT SINK-H000161 |
| Minimum Order Quantity: | 100PCS |
| Packaging Details: | Blister packaging |
| Delivery Time: | 20-30days |
| Payment Terms: | T/T, Western Union |
| Supply Ability: | 30000 PCS Per month |
| Price: | EXW/FOB/CIF/DDP | Raw Material: | AL6063-T5 |
|---|---|---|---|
| Surface Treatment: | Anodizing Natural | Application: | Heat Sink |
| Processing Service: | Cutting, CNC,Anodizing | Delivery Time: | 20-30days |
| Keyword: | Aluminum Profile Heat Sink | ||
| High Light: | 6063 Aluminum Extrusion Heatsink,Profiles Aluminum Extrusion Heatsink,Electronic Aluminum Heatsink Extrusion Profiles |
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Fodor factory offer aluminum 6063 profile custom heat sink with ISO9001:2015
Quick Detail
| Raw Material | AL6063-T5 |
| Custom Service | Yes, OEM/ODM Service |
| Quality System | ISO9001:2015 |
| Processing Technology | Cutting/Wood machining/CNC/Riveting |
| Surface treatment | Clear Andizing |
| Packing Way | Blister packaging or special packing you would like |
| Application Scenario | Electronic equipment heat sink |
| MOQ Request | 100/500/1000 |
Description
This heat sink is based aluminum profile 6063-T5 material to processing, first of all, we check the raw material dimension is fine or not, the second is that according to the drawing, cutting right length, the third is that accroding to the drawing, use the wood machine to cut the outline dimension, the forth is that use the CNC to do exact dimension, the fifth is do anodizing clear, the last step is riveting, and then inspection/packing. First inspection and patrol inspection are done in processing .
Workshop
Technical Support
We can offer the design and simulation service. For example, our German customer's case.
According to the simulation results,the simulated chip is in compliance with the temperature requirements specficied by customer.
Learning organization
In order to provide better service for our customers, we continue to strengthen the construction of scholar organization.
